Basic Electronics & Physics
Solid State Physics, Electronics & Digital Systems
From semiconductor physics to Arduino sensors โ master the complete foundation of modern electronics engineering across 6 comprehensive units.
โฑ๏ธ 30+ hrs | ๐ฏ GATE ~8โ12 marks | ๐ฐ โน5โ15 LPA | ๐ฌ VLSI to IoT
Solid State Physics
๐ฌ How a Grain of Silicon Powers Your Entire World
In 2024, Intel announced a $33 billion investment to build chip fabrication plants. Meanwhile, India's Semi-Conductor Laboratory (SCL) Mohali is being upgraded under the India Semiconductor Mission. Every smartphone, laptop, and satellite โ from your โน10,000 Redmi phone to ISRO's NavIC satellites โ runs on the physics you're about to learn.
A single modern processor contains 100+ billion transistors, each just 3 nanometers wide (30 atoms!). All of this is possible because of solid state physics โ the science of how electrons behave inside crystalline solids.
Free Electron Theory (Drude Model)
The free electron theory, proposed by Paul Drude in 1900, treats valence electrons in a metal as a "gas" of free particles that can move through the crystal lattice.
Key Assumptions of the Drude Model
- Valence electrons are free to move throughout the metal (they are not bound to any particular atom).
- Electrons do not interact with each other (independent electron approximation).
- Electrons collide with ion cores (lattice atoms), not with each other. The average time between collisions is the relaxation time $\tau$.
- After each collision, the electron's velocity is randomized โ it "forgets" its previous direction.
- Between collisions, electrons obey Newton's laws (classical mechanics).
Diffusion Current
When there is a concentration gradient of charge carriers (more electrons in one region than another), carriers diffuse from high to low concentration, creating a diffusion current:
$$J_{diff,n} = q D_n\frac{dn}{dx} \quad \text{(for electrons)}$$ $$J_{diff,p} = -q D_p\frac{dp}{dx} \quad \text{(for holes)}$$where $D_n, D_p$ are diffusion coefficients. The Einstein relation connects diffusion and mobility: $D = \frac{kT}{q}\mu$.
Drift Current
Without an external field, electrons move randomly with zero net displacement. When an electric field $\vec{E}$ is applied, electrons acquire a small drift velocity $v_d$ superimposed on their random motion.
The drift current density $J$ is the current per unit cross-sectional area:
$$J_{drift} = \frac{I}{A} \quad \text{(A/cmยฒ)}$$Since current is the flow of charge carriers, we can write:
$$J = n \cdot q \cdot v_d = \rho_v \cdot v_d$$where $n$ = carrier concentration (number/cmยณ), $q$ = charge of carrier, $v_d$ = drift velocity (cm/s), and $\rho_v = n \cdot q$ is the volume charge density (C/cmยณ).
Mobility ($\mu$)
The drift velocity is proportional to the applied electric field:
$$\boxed{v_d = \mu \cdot E}$$where $\mu$ is the mobility of the charge carrier (cmยฒ/Vยทs). Mobility is a measure of how easily charge carriers move under the influence of an applied electric field โ it determines how mobile the charge carriers are.
Substituting $v_d = \mu E$ into the current density equation:
$$\boxed{J = n \cdot q \cdot \mu \cdot E}$$Conductivity of a Semiconductor ($\sigma$)
In a semiconductor, both electrons and holes contribute to drift current. We write the current density for each carrier separately:
Hole drift current:
$$J_p = p \cdot q \cdot \mu_p \cdot E$$Electron drift current:
$$J_n = n \cdot q \cdot \mu_n \cdot E$$The total drift current density is the sum of both:
$$J = J_p + J_n = p q \mu_p E + n q \mu_n E$$ $$\boxed{J = (p\mu_p + n\mu_n) \cdot q \cdot E = \sigma \cdot E}$$where the conductivity of the semiconductor is:
$$\boxed{\sigma = (p\mu_p + n\mu_n) \cdot q} \quad \text{(ฮฉยทcm)}^{-1}$$Conductivity for Different Semiconductor Types
Intrinsic Semiconductor: Since $n = p = n_i$:
$$\sigma = (\mu_p + \mu_n) \cdot n_i \cdot q$$N-type Semiconductor: Since $n \gg p$ (electrons dominate):
$$\sigma \approx n \cdot q \cdot \mu_n \approx N_D \cdot q \cdot \mu_n$$P-type Semiconductor: Since $p \gg n$ (holes dominate):
$$\sigma \approx p \cdot q \cdot \mu_p \approx N_A \cdot q \cdot \mu_p$$Fermi Energy & Fermi-Dirac Distribution
How to Count the Number of Carriers?
To determine how many electrons participate in conduction, we need two things:
- Density of States $g(E)$ โ tells us how many energy states exist at a given energy $E$.
- Fermi-Dirac Distribution Function $f(E)$ โ tells us the probability that an available state at energy $E$ is occupied by an electron.
The total carrier concentration is then:
$$n = \int g(E) \cdot f(E) \, dE$$In other words: Number of carriers = (Number of available states) ร (Probability of occupation).
The Fermi-Dirac Distribution Function
The Fermi energy $E_F$ is the highest energy level occupied by electrons at absolute zero (0 K). It represents the "top of the filled electron sea." It is the energy of the highest occupied quantum state.
At any temperature $T$, the probability that a quantum state at energy $E$ is occupied by an electron is given by the Fermi-Dirac distribution function:
$$f(E) = \frac{1}{1 + e^{(E - E_F)/kT}}$$where $E_F$ = Fermi energy, $k$ = Boltzmann constant ($1.38 \times 10^{-23}$ J/K = $8.6 \times 10^{-5}$ eV/K), and $T$ = absolute temperature in Kelvin.
Meaning of Fermi Level
The Fermi level ($E_F$) is the energy level with exactly 50% probability of finding an electron, at any temperature $T > 0$ K. When $E = E_F$:
$$f(E_F) = \frac{1}{1 + e^0} = \frac{1}{2} = 50\%$$Key Properties of Fermi-Dirac Distribution
| Condition | f(E) | Meaning |
|---|---|---|
| $E = E_F$ | $\frac{1}{2}$ (always 50%) | Fermi level is the 50% probability point |
| $E \ll E_F$ | $\approx 1$ | States well below $E_F$ are fully occupied |
| $E \gg E_F$ | $\approx 0$ | States well above $E_F$ are empty |
| $T = 0$ K | Step function | All states below $E_F$ filled, all above empty |
| $T > 0$ K | Smooth curve | Some states near $E_F$ become partially occupied |
Effect of Temperature on Fermi-Dirac Distribution
- At $T = 0$ K, the electrons have the lowest energy and occupy the lower energy states. The distribution is a sharp step function โ all states below $E_F$ are completely filled, all above are completely empty.
- As the temperature increases, electrons gain thermal energy. Some electrons near $E_F$ get excited to higher energy states. The sharp step smooths out into an S-shaped curve. The higher the temperature, the more gradual the transition around $E_F$.
- The Fermi level itself is independent of temperature in metals (it remains the 50% probability point).
Significance of Fermi Level
- It is used to separate vacant and filled states at 0 K.
- It tells us the status of electrons โ whether states at a given energy are likely occupied or empty.
- Electrons are completely filled below the Fermi energy level and completely empty above it at 0 K.
- At temperatures above 0 K, some electrons absorb thermal energy and jump to higher energy levels, creating the smooth distribution.
- In semiconductors, the position of $E_F$ relative to the band edges tells us the type and degree of doping.
Total Current Density in a Semiconductor
In a semiconductor, current flows due to both drift (due to electric field) and diffusion (due to concentration gradient). The total current density combines both contributions from electrons and holes:
$$J_{total} = J_{drift} + J_{diffusion}$$ $$J_{total} = \underbrace{(ne\mu_e + pe\mu_h)E}_{\text{Drift}} + \underbrace{\left(eD_n\frac{dn}{dx} - eD_p\frac{dp}{dx}\right)}_{\text{Diffusion}}$$where $n, p$ = electron and hole concentrations, $\mu_e, \mu_h$ = mobilities, and $D_n, D_p$ = diffusion coefficients.
Band Theory of Solids
When atoms come together to form a solid, their discrete energy levels split into bands of closely spaced energy levels due to the interaction between atomic orbitals. Instead of single energy levels, there will be bands of energy levels formed due to the intermixing of atoms. These sets of closely packed energy levels are called Energy Bands.
Formation of Energy Bands
Consider $N$ atoms of silicon brought together:
- Each atom has discrete energy levels (1s, 2s, 2p, 3s, 3p).
- As atoms approach, the Pauli exclusion principle forces the $N$ identical energy levels to split into $N$ closely spaced but distinct levels.
- These $N$ levels form a quasi-continuous band.
Valence Band
The electrons present in the outermost shell are called Valence Electrons. These valence electrons, containing a series of energy levels, form an energy band called the Valence Band. The valence band is the band having the highest occupied energy.
Conduction Band
Some valence electrons gain enough energy to leave their atoms and become free electrons, which can move toward neighboring atoms. These free electrons are the ones that conduct current in a conductor and are hence called Conduction Electrons. The band containing these conduction electrons is called the Conduction Band โ it is the band having the lowest unoccupied energy.
Forbidden Energy Gap ($E_g$)
The gap between the valence band and the conduction band is called the Forbidden Energy Gap. No electron can exist in this energy range. Depending upon the size of this forbidden gap, materials are classified as Insulators, Semiconductors, or Conductors.
Classification of Solids Based on Band Gap
Insulators
Insulators are materials in which conduction cannot take place due to a very large forbidden gap. Examples: Wood, Rubber, Diamond, Glass.
- The forbidden energy gap is very large (~10 eV for some insulators, 5.5 eV for diamond).
- Valence band electrons are bound tightly to atoms.
- For some insulators, as the temperature increases, they might show a very small amount of conduction.
- Resistivity is in the order of $10^7$ ฮฉยทm or higher.
- The conduction band is completely empty at room temperature.
Conductors
Conductors are materials in which the forbidden energy gap disappears โ the valence band and conduction band overlap. Examples: Copper, Aluminum, Silver.
- There is no forbidden gap; the valence and conduction bands overlap.
- A slight increase in voltage increases the conduction immediately.
- There is no concept of hole formation as a continuous flow of electrons contributes to the current.
- Resistivity is very low ($\sim 10^{-8}$ ฮฉยทm).
Semiconductors
Semiconductors are materials in which the forbidden energy gap is small and conduction takes place if some external energy is applied. Examples: Silicon, Germanium.
- The forbidden energy gap is small: Ge โ 0.7 eV, Si โ 1.1 eV.
- A semiconductor is actually neither an insulator nor a good conductor.
- As the temperature increases, the conductivity increases (more electrons gain enough energy to jump the gap).
- Conductivity is in the order of $10^2$ mho/m.
- Both electrons and holes contribute to current.
| Property | Conductor | Semiconductor | Insulator |
|---|---|---|---|
| Band Gap $E_g$ | 0 eV (bands overlap) | 0.1 โ 3 eV | > 3 eV |
| Examples | Cu, Ag, Al | Si (1.1 eV), Ge (0.67 eV) | Diamond (5.5 eV), Glass |
| Resistivity | $\sim 10^{-8}$ ฮฉยทm | $10^{-5}$ to $10^{6}$ ฮฉยทm | $\gt 10^{7}$ ฮฉยทm |
| Temperature Effect | Conductivity decreases | Conductivity increases | Remains insulator |
| Current Carriers | Electrons only | Electrons and Holes | None at room temp |
Concept of Effective Mass
Inside a crystal, an electron does not behave as a free particle because it interacts with the periodic potential of the lattice. We account for this by assigning it an effective mass $m^*$:
$$m^* = \frac{\hbar^2}{\frac{d^2E}{dk^2}}$$where $E$ is the electron energy and $k$ is the wave vector (from the E-k diagram).
- At the bottom of the conduction band, the band curves upward sharply โ small $m^*$ โ electrons are "light" and mobile.
- At the top of the valence band, the band curves downward โ negative $m^*$ โ this is mathematically treated as a positive particle called a hole.
Hall Effect (Complete Derivation)
The Hall effect, discovered by Edwin Hall in 1879, is used to determine the type (n or p), concentration, and mobility of charge carriers in a material.
Setup
Consider a rectangular conductor of width $w$, thickness $t$, carrying current $I$ along the x-direction. A magnetic field $\vec{B}$ is applied along the z-direction (perpendicular to the current).
Step-by-Step Derivation
Step 1: Electrons moving with drift velocity $v_d$ in the x-direction experience a Lorentz force:
$$\vec{F} = -e(\vec{v_d} \times \vec{B})$$This force pushes electrons toward one face of the conductor (say, the bottom face).
Step 2: Electrons accumulate on the bottom face, creating a transverse electric field $E_H$ (Hall field) pointing from top to bottom. This field exerts a force $eE_H$ on the electrons, opposing further accumulation.
Step 3: At equilibrium, the electric force balances the magnetic force:
$$eE_H = ev_dB$$ $$E_H = v_dB$$Step 4: The Hall voltage across the width $w$ is:
$$V_H = E_H \cdot w = v_d B w$$Step 5: Since current density $J = nev_d$ and $I = Jwt$, we get $v_d = \frac{I}{newt}$. Substituting:
$$\boxed{V_H = \frac{BI}{net}}$$Step 6: The Hall coefficient is defined as:
$$\boxed{R_H = \frac{1}{ne}} \quad \text{(for n-type: } R_H \text{ is negative)}$$ $$\boxed{R_H = \frac{1}{pe}} \quad \text{(for p-type: } R_H \text{ is positive)}$$Applications of the Hall Effect
- Determine carrier type: Sign of $V_H$ tells n-type vs p-type.
- Measure carrier concentration: $n = \frac{BI}{V_H e t}$.
- Calculate mobility: $\mu = |R_H| \sigma = \frac{|R_H|}{\rho}$.
- Hall sensors: Used in smartphones (compass), automotive (speed sensors), and brushless DC motors.
Solved Example: Hall Effect
Numerical Problem
Problem: A silicon sample has Hall coefficient $R_H = 3.66 \times 10^{-4}$ mยณ/C. If the conductivity is $\sigma = 112$ S/m, find: (a) carrier concentration, (b) carrier mobility.
Solution:
(a) $n = \frac{1}{R_H \cdot e} = \frac{1}{3.66 \times 10^{-4} \times 1.6 \times 10^{-19}} = 1.7 \times 10^{22}$ /mยณ
(b) $\mu = R_H \cdot \sigma = 3.66 \times 10^{-4} \times 112 = 0.041$ mยฒ/Vยทs $= 410$ cmยฒ/Vยทs
Semiconductors: Intrinsic & Extrinsic
Intrinsic Semiconductors
An intrinsic semiconductor is a pure semiconductor with no impurities added. Germanium (Ge) and Silicon (Si), both Group IV elements, are the best examples. They possess a diamond cubic crystalline structure where each atom forms 4 covalent bonds with its neighbors by sharing one valence electron each.
At 0 K, all valence band states are filled and the conduction band is empty โ the material behaves as an insulator. At room temperature, thermal energy excites some electrons across the band gap, creating electron-hole pairs (EHP).
Electron-Hole Pair (EHP) Generation
When suitable energy (thermal, optical, etc.) is supplied to a semiconductor, electrons make a transition from the Valence Band to the Conduction Band. This simultaneously creates:
- A free electron in the Conduction Band
- A free hole (vacant site) in the Valence Band
This process is called Electron-Hole Pair Generation. In an intrinsic semiconductor, the number of conduction electrons is always equal to the number of holes: $n = p = n_i$.
Carrier Concentration in Intrinsic Semiconductors
Using the Density of States $g(E)$ and the Fermi-Dirac distribution $f(E)$, we can derive the equilibrium carrier concentrations:
Electrons in the Conduction Band:
$$n = N_C \exp\left(-\frac{E_C - E_F}{kT}\right)$$where $N_C = 2\left(\frac{2\pi m_e^* kT}{h^2}\right)^{3/2}$ is the effective density of states in the conduction band.
Holes in the Valence Band:
$$p = N_V \exp\left(-\frac{E_F - E_V}{kT}\right)$$where $N_V = 2\left(\frac{2\pi m_h^* kT}{h^2}\right)^{3/2}$ is the effective density of states in the valence band.
Intrinsic Concentration ($n_i$)
Since $n = p = n_i$ in an intrinsic semiconductor, multiplying the two equations:
$$n \cdot p = n_i^2 = N_C N_V \exp\left(-\frac{E_g}{kT}\right)$$ $$\boxed{n_i = \sqrt{N_C N_V} \exp\left(-\frac{E_g}{2kT}\right)}$$This shows that intrinsic concentration increases exponentially with temperature and decreases with larger band gap.
Mass Action Law
The product of electron and hole concentrations in a semiconductor at thermal equilibrium is always constant, regardless of doping:
$$\boxed{n \cdot p = n_i^2}$$This is called the Mass Action Law. It means that if you increase the electron concentration by doping (N-type), the hole concentration must decrease proportionally, and vice versa.
Fermi Level in Intrinsic Semiconductor
The Fermi level is the energy level at which the probability of finding an electron is equal to the probability of finding a hole. For an intrinsic semiconductor, setting $n = p$ and solving:
$$E_F = \frac{E_C + E_V}{2} + \frac{3}{4}kT \ln\left(\frac{m_h^*}{m_e^*}\right)$$If $m_e^* \approx m_h^*$ (which is approximately true), then:
$$\boxed{E_F \approx \frac{E_C + E_V}{2} = E_i}$$The Fermi level lies approximately at the middle of the band gap. This mid-gap energy is called the intrinsic Fermi level $E_i$.
Conductivity of an intrinsic semiconductor: $\sigma = n_i e(\mu_e + \mu_h)$
Extrinsic Semiconductors
Extrinsic semiconductors are those in which impurities are deliberately added (doping) to dramatically increase conductivity. Based on the type of impurity, they are classified into two categories:
N-Type Semiconductor
When a pentavalent element such as Phosphorus (P), Arsenic (As), or Antimony (Sb) is added to the intrinsic semiconductor:
- Four of its five valence electrons form covalent bonds with four neighboring Si atoms.
- The fifth electron is weakly bound to the parent atom. Even with a small amount of thermal energy, it is released, leaving the parent atom positively ionized.
- These released electrons become free and can contribute to conduction.
- The energy level of this fifth electron is called the Donor Level, which lies just below the conduction band ($E_D \approx E_C - 0.01$ to $0.05$ eV).
Result: Electrons are majority carriers and holes are minority carriers. The pentavalent impurity is called a Donor because it donates electrons.
P-Type Semiconductor
When a trivalent element such as Boron (B), Aluminum (Al), Gallium (Ga), or Indium (In) is added to the intrinsic semiconductor:
- All three valence electrons engage in covalent bonding with three neighboring Si atoms.
- The impurity atom needs one more electron to complete its fourth bond. This electron may be supplied by a neighboring Si atom, thereby creating a hole on the semiconductor atom.
- The energy level of this impurity atom is called the Acceptor Level, which lies just above the valence band ($E_A \approx E_V + 0.01$ to $0.05$ eV).
- Even at relatively low temperatures, these acceptor atoms get ionized by taking electrons from the valence band, giving rise to holes for conduction.
Result: Holes are majority carriers and electrons are minority carriers. The trivalent impurity is called an Acceptor because it accepts electrons.
| Property | N-type | P-type |
|---|---|---|
| Dopant | Pentavalent (P, As, Sb) | Trivalent (B, Al, Ga, In) |
| Impurity type | Donor | Acceptor |
| Majority carrier | Electrons | Holes |
| Minority carrier | Holes | Electrons |
| Energy level | Donor level near $E_C$ | Acceptor level near $E_V$ |
| Fermi level | Closer to conduction band | Closer to valence band |
| Current direction | Electron current | Hole current (opposite to electron flow) |
Charge Neutrality & Charge Densities
In a semiconductor under thermal equilibrium, the total positive charge must equal the total negative charge. This gives the charge neutrality equation:
$$\boxed{n + N_A^- = p + N_D^+}$$where $N_D^+$ = ionized donor concentration, $N_A^-$ = ionized acceptor concentration. At room temperature, all dopants are typically fully ionized, so $N_D^+ \approx N_D$ and $N_A^- \approx N_A$.
For an N-type semiconductor ($N_D \gg N_A$, $n \gg p$): $n \approx N_D$ and $p = n_i^2/N_D$
For a P-type semiconductor ($N_A \gg N_D$, $p \gg n$): $p \approx N_A$ and $n = n_i^2/N_A$
Fermi Level in Extrinsic Semiconductors
In N-type: The Fermi level shifts toward the conduction band. At low temperatures, it lies between the donor level and $E_C$. As temperature increases, more donor atoms get ionized, and eventually the material behaves intrinsically, with $E_F$ moving back toward the mid-gap $E_i$.
In P-type: The Fermi level shifts toward the valence band. At low temperatures, it lies between the acceptor level and $E_V$. With increasing temperature, $E_F$ gradually moves toward $E_i$.
Variation of Fermi Level with Temperature
- Initially, with a small increase in temperature, $E_F$ increases slightly (in N-type) or decreases slightly (in P-type).
- As temperature rises, more and more dopant atoms are ionized.
- At very high temperatures, the generation of electron-hole pairs due to breaking of covalent bonds dominates over doping. The material tends to behave in an intrinsic manner, and the Fermi level gradually moves toward the intrinsic Fermi level $E_i$ (mid-gap).
Properties of Germanium & Silicon
| Property | Germanium (Ge) | Silicon (Si) |
|---|---|---|
| Atomic Number | 32 | 14 |
| Band Gap $E_g$ | 0.67 eV | 1.12 eV |
| Intrinsic concentration $n_i$ (at 300 K) | $2.4 \times 10^{13}$ /cmยณ | $1.5 \times 10^{10}$ /cmยณ |
| Crystal Structure | Diamond cubic | Diamond cubic |
| Electron mobility $\mu_e$ | 3900 cmยฒ/Vยทs | 1350 cmยฒ/Vยทs |
| Hole mobility $\mu_h$ | 1900 cmยฒ/Vยทs | 480 cmยฒ/Vยทs |
| Dielectric constant | 16 | 11.8 |
Generation & Recombination
Generation is the process where electron-hole pairs are created by exciting an electron from the valence band to the conduction band. Recombination is the reverse process where electrons and holes recombine and are annihilated.
In thermal equilibrium, the generation and recombination processes are in dynamic equilibrium โ the rate of generation equals the rate of recombination.
Types of Generation/Recombination Processes
- Photon Transition (Optical) โ Absorption of a photon creates an EHP; emission of a photon occurs during recombination (used in LEDs and solar cells).
- Phonon Transition (Shockley-Read-Hall / SRH) โ Recombination through trap states (defects/impurities) in the forbidden gap. Most common in indirect bandgap semiconductors like Si.
- Auger Recombination โ A three-particle process where the energy released during recombination is transferred to a third carrier instead of a photon. Important at very high carrier concentrations.
- Impact Ionization โ A high-energy carrier collides with the lattice and generates a new EHP. This is the mechanism behind avalanche breakdown in diodes.
Carrier Lifetime
The carrier lifetime ($\tau$) is the average time a minority carrier exists before recombining. It determines how far carriers can diffuse before recombining, and is critical for device performance:
$$L = \sqrt{D \cdot \tau}$$where $L$ is the diffusion length and $D$ is the diffusion coefficient. A longer carrier lifetime means carriers travel farther before recombining โ essential for solar cells and transistors.
Direct vs Indirect Band Gap
| Property | Direct Band Gap | Indirect Band Gap |
|---|---|---|
| E-k diagram | CB minimum and VB maximum at same $k$ | CB minimum and VB maximum at different $k$ |
| Transition | Electron can directly emit/absorb photon | Requires phonon (lattice vibration) assist |
| Examples | GaAs, InP, GaN | Si, Ge |
| Applications | LEDs, Laser diodes, solar cells | Transistors, ICs, CPUs |
Solar Cells & Computational Applications
Solar Cell Basics
A solar cell is a PN junction operated under illumination. When photons with energy $h\nu \geq E_g$ strike the cell, electron-hole pairs are generated in the depletion region. The built-in electric field separates them โ electrons go to n-side, holes to p-side โ creating a photocurrent and photovoltage.
- Open-circuit voltage: $V_{OC} = \frac{kT}{q}\ln\left(\frac{I_L}{I_0} + 1\right)$
- Short-circuit current: $I_{SC} \approx I_L$ (photogenerated current)
- Efficiency: $\eta = \frac{P_{max}}{P_{incident}} = \frac{V_{OC} \cdot I_{SC} \cdot FF}{P_{in}}$ where $FF$ is the fill factor (~0.7โ0.85).
Computational Applications
Chip Fabrication Basics
Modern CPUs and GPUs are built on silicon wafers using a highly complex manufacturing process called fabrication. The key steps include:
- Wafer Preparation: Pure silicon is grown into a single-crystal ingot and sliced into ultra-thin circular wafers.
- Photolithography: The wafer is coated with a light-sensitive photoresist. UV light shines through a "mask" (blueprint of the circuit), printing nanometer-scale patterns onto the wafer.
- Etching & Deposition: Chemicals etch away unprotected areas to create 3D structures, while new materials (insulators, metals) are deposited in layers.
- Doping (Ion Implantation): High-energy ion beams shoot specific impurities (like Boron or Phosphorus) into the silicon to create N-type and P-type regions, forming the actual transistors.
This cycle repeats 50+ times to build billions of microscopic transistors layer by layer.
CMOS Technology
CMOS (Complementary Metal-Oxide-Semiconductor) uses pairs of NMOS and PMOS transistors. A CMOS inverter has near-zero static power consumption because only one transistor is ON at a time. This is why modern CPUs can have billions of transistors without melting!
Memory Devices
SRAM: Uses 6 transistors per bit. Fast but expensive. Used in CPU cache.
DRAM: Uses 1 transistor + 1 capacitor per bit. Slower but dense. Used as main RAM.
Flash/SSD: Uses floating-gate transistors. Electrons trapped on the floating gate represent stored data. NAND flash stacks cells vertically (3D NAND) for massive storage.
AI Accelerator Chips & IoT Sensors
GPU: Thousands of small cores for parallel matrix multiplication โ ideal for neural network training.
TPU (Google's Tensor Processing Unit): Custom ASIC designed specifically for matrix operations in AI/ML.
IoT Sensors: Semiconductor-based sensors (temperature, pressure, gas, light) use changes in resistance, capacitance, or current due to physical stimuli.
Semiconductors: Intrinsic & Extrinsic
Intrinsic Semiconductors
An intrinsic semiconductor is a pure semiconductor with no impurities added. Germanium (Ge) and Silicon (Si), both Group IV elements, are the best examples. They possess a diamond cubic crystalline structure where each atom forms 4 covalent bonds with its neighbors by sharing one valence electron each.
At 0 K, all valence band states are filled and the conduction band is empty โ the material behaves as an insulator. At room temperature, thermal energy excites some electrons across the band gap, creating electron-hole pairs (EHP).
Electron-Hole Pair (EHP) Generation
When suitable energy (thermal, optical, etc.) is supplied to a semiconductor, electrons make a transition from the Valence Band to the Conduction Band. This simultaneously creates:
- A free electron in the Conduction Band
- A free hole (vacant site) in the Valence Band
This process is called Electron-Hole Pair Generation. In an intrinsic semiconductor, the number of conduction electrons is always equal to the number of holes: $n = p = n_i$.
Carrier Concentration in Intrinsic Semiconductors
Using the Density of States $g(E)$ and the Fermi-Dirac distribution $f(E)$, we can derive the equilibrium carrier concentrations:
Electrons in the Conduction Band:
$$n = N_C \exp\left(-\frac{E_C - E_F}{kT}\right)$$where $N_C = 2\left(\frac{2\pi m_e^* kT}{h^2}\right)^{3/2}$ is the effective density of states in the conduction band.
Holes in the Valence Band:
$$p = N_V \exp\left(-\frac{E_F - E_V}{kT}\right)$$where $N_V = 2\left(\frac{2\pi m_h^* kT}{h^2}\right)^{3/2}$ is the effective density of states in the valence band.
Intrinsic Concentration ($n_i$)
Since $n = p = n_i$ in an intrinsic semiconductor, multiplying the two equations:
$$n \cdot p = n_i^2 = N_C N_V \exp\left(-\frac{E_g}{kT}\right)$$ $$\boxed{n_i = \sqrt{N_C N_V} \exp\left(-\frac{E_g}{2kT}\right)}$$This shows that intrinsic concentration increases exponentially with temperature and decreases with larger band gap.
Mass Action Law
The product of electron and hole concentrations in a semiconductor at thermal equilibrium is always constant, regardless of doping:
$$\boxed{n \cdot p = n_i^2}$$This is called the Mass Action Law. It means that if you increase the electron concentration by doping (N-type), the hole concentration must decrease proportionally, and vice versa.
Fermi Level in Intrinsic Semiconductor
The Fermi level is the energy level at which the probability of finding an electron is equal to the probability of finding a hole. For an intrinsic semiconductor, setting $n = p$ and solving:
$$E_F = \frac{E_C + E_V}{2} + \frac{3}{4}kT \ln\left(\frac{m_h^*}{m_e^*}\right)$$If $m_e^* \approx m_h^*$ (which is approximately true), then:
$$\boxed{E_F \approx \frac{E_C + E_V}{2} = E_i}$$The Fermi level lies approximately at the middle of the band gap. This mid-gap energy is called the intrinsic Fermi level $E_i$.
Conductivity of an intrinsic semiconductor: $\sigma = n_i e(\mu_e + \mu_h)$
Extrinsic Semiconductors
Extrinsic semiconductors are those in which impurities are deliberately added (doping) to dramatically increase conductivity. Based on the type of impurity, they are classified into two categories:
N-Type Semiconductor
When a pentavalent element such as Phosphorus (P), Arsenic (As), or Antimony (Sb) is added to the intrinsic semiconductor:
- Four of its five valence electrons form covalent bonds with four neighboring Si atoms.
- The fifth electron is weakly bound to the parent atom. Even with a small amount of thermal energy, it is released, leaving the parent atom positively ionized.
- These released electrons become free and can contribute to conduction.
- The energy level of this fifth electron is called the Donor Level, which lies just below the conduction band ($E_D \approx E_C - 0.01$ to $0.05$ eV).
Result: Electrons are majority carriers and holes are minority carriers. The pentavalent impurity is called a Donor because it donates electrons.
P-Type Semiconductor
When a trivalent element such as Boron (B), Aluminum (Al), Gallium (Ga), or Indium (In) is added to the intrinsic semiconductor:
- All three valence electrons engage in covalent bonding with three neighboring Si atoms.
- The impurity atom needs one more electron to complete its fourth bond. This electron may be supplied by a neighboring Si atom, thereby creating a hole on the semiconductor atom.
- The energy level of this impurity atom is called the Acceptor Level, which lies just above the valence band ($E_A \approx E_V + 0.01$ to $0.05$ eV).
- Even at relatively low temperatures, these acceptor atoms get ionized by taking electrons from the valence band, giving rise to holes for conduction.
Result: Holes are majority carriers and electrons are minority carriers. The trivalent impurity is called an Acceptor because it accepts electrons.
| Property | N-type | P-type |
|---|---|---|
| Dopant | Pentavalent (P, As, Sb) | Trivalent (B, Al, Ga, In) |
| Impurity type | Donor | Acceptor |
| Majority carrier | Electrons | Holes |
| Minority carrier | Holes | Electrons |
| Energy level | Donor level near $E_C$ | Acceptor level near $E_V$ |
| Fermi level | Closer to conduction band | Closer to valence band |
| Current direction | Electron current | Hole current (opposite to electron flow) |
Charge Neutrality & Charge Densities
In a semiconductor under thermal equilibrium, the total positive charge must equal the total negative charge. This gives the charge neutrality equation:
$$\boxed{n + N_A^- = p + N_D^+}$$where $N_D^+$ = ionized donor concentration, $N_A^-$ = ionized acceptor concentration. At room temperature, all dopants are typically fully ionized, so $N_D^+ \approx N_D$ and $N_A^- \approx N_A$.
For an N-type semiconductor ($N_D \gg N_A$, $n \gg p$): $n \approx N_D$ and $p = n_i^2/N_D$
For a P-type semiconductor ($N_A \gg N_D$, $p \gg n$): $p \approx N_A$ and $n = n_i^2/N_A$
Fermi Level in Extrinsic Semiconductors
In N-type: The Fermi level shifts toward the conduction band. At low temperatures, it lies between the donor level and $E_C$. As temperature increases, more donor atoms get ionized, and eventually the material behaves intrinsically, with $E_F$ moving back toward the mid-gap $E_i$.
In P-type: The Fermi level shifts toward the valence band. At low temperatures, it lies between the acceptor level and $E_V$. With increasing temperature, $E_F$ gradually moves toward $E_i$.
Variation of Fermi Level with Temperature
- Initially, with a small increase in temperature, $E_F$ increases slightly (in N-type) or decreases slightly (in P-type).
- As temperature rises, more and more dopant atoms are ionized.
- At very high temperatures, the generation of electron-hole pairs due to breaking of covalent bonds dominates over doping. The material tends to behave in an intrinsic manner, and the Fermi level gradually moves toward the intrinsic Fermi level $E_i$ (mid-gap).
Properties of Germanium & Silicon
| Property | Germanium (Ge) | Silicon (Si) |
|---|---|---|
| Atomic Number | 32 | 14 |
| Band Gap $E_g$ | 0.67 eV | 1.12 eV |
| Intrinsic concentration $n_i$ (at 300 K) | $2.4 \times 10^{13}$ /cmยณ | $1.5 \times 10^{10}$ /cmยณ |
| Crystal Structure | Diamond cubic | Diamond cubic |
| Electron mobility $\mu_e$ | 3900 cmยฒ/Vยทs | 1350 cmยฒ/Vยทs |
| Hole mobility $\mu_h$ | 1900 cmยฒ/Vยทs | 480 cmยฒ/Vยทs |
| Dielectric constant | 16 | 11.8 |
Generation & Recombination
Generation is the process where electron-hole pairs are created by exciting an electron from the valence band to the conduction band. Recombination is the reverse process where electrons and holes recombine and are annihilated.
In thermal equilibrium, the generation and recombination processes are in dynamic equilibrium โ the rate of generation equals the rate of recombination.
Types of Generation/Recombination Processes
- Photon Transition (Optical) โ Absorption of a photon creates an EHP; emission of a photon occurs during recombination (used in LEDs and solar cells).
- Phonon Transition (Shockley-Read-Hall / SRH) โ Recombination through trap states (defects/impurities) in the forbidden gap. Most common in indirect bandgap semiconductors like Si.
- Auger Recombination โ A three-particle process where the energy released during recombination is transferred to a third carrier instead of a photon. Important at very high carrier concentrations.
- Impact Ionization โ A high-energy carrier collides with the lattice and generates a new EHP. This is the mechanism behind avalanche breakdown in diodes.
Carrier Lifetime
The carrier lifetime ($\tau$) is the average time a minority carrier exists before recombining. It determines how far carriers can diffuse before recombining, and is critical for device performance:
$$L = \sqrt{D \cdot \tau}$$where $L$ is the diffusion length and $D$ is the diffusion coefficient. A longer carrier lifetime means carriers travel farther before recombining โ essential for solar cells and transistors.
Direct vs Indirect Band Gap
| Property | Direct Band Gap | Indirect Band Gap |
|---|---|---|
| E-k diagram | CB minimum and VB maximum at same $k$ | CB minimum and VB maximum at different $k$ |
| Transition | Electron can directly emit/absorb photon | Requires phonon (lattice vibration) assist |
| Examples | GaAs, InP, GaN | Si, Ge |
| Applications | LEDs, Laser diodes, solar cells | Transistors, ICs, CPUs |
Solar Cells & Computational Applications
Solar Cell Basics
A solar cell is a PN junction operated under illumination. When photons with energy $h\nu \geq E_g$ strike the cell, electron-hole pairs are generated in the depletion region. The built-in electric field separates them โ electrons go to n-side, holes to p-side โ creating a photocurrent and photovoltage.
- Open-circuit voltage: $V_{OC} = \frac{kT}{q}\ln\left(\frac{I_L}{I_0} + 1\right)$
- Short-circuit current: $I_{SC} \approx I_L$ (photogenerated current)
- Efficiency: $\eta = \frac{P_{max}}{P_{incident}} = \frac{V_{OC} \cdot I_{SC} \cdot FF}{P_{in}}$ where $FF$ is the fill factor (~0.7โ0.85).
Computational Applications
Chip Fabrication Basics
Modern CPUs and GPUs are built on silicon wafers using a highly complex manufacturing process called fabrication. The key steps include:
- Wafer Preparation: Pure silicon is grown into a single-crystal ingot and sliced into ultra-thin circular wafers.
- Photolithography: The wafer is coated with a light-sensitive photoresist. UV light shines through a "mask" (blueprint of the circuit), printing nanometer-scale patterns onto the wafer.
- Etching & Deposition: Chemicals etch away unprotected areas to create 3D structures, while new materials (insulators, metals) are deposited in layers.
- Doping (Ion Implantation): High-energy ion beams shoot specific impurities (like Boron or Phosphorus) into the silicon to create N-type and P-type regions, forming the actual transistors.
This cycle repeats 50+ times to build billions of microscopic transistors layer by layer.
CMOS Technology
CMOS (Complementary Metal-Oxide-Semiconductor) uses pairs of NMOS and PMOS transistors. A CMOS inverter has near-zero static power consumption because only one transistor is ON at a time. This is why modern CPUs can have billions of transistors without melting!
Memory Devices
SRAM: Uses 6 transistors per bit. Fast but expensive. Used in CPU cache.
DRAM: Uses 1 transistor + 1 capacitor per bit. Slower but dense. Used as main RAM.
Flash/SSD: Uses floating-gate transistors. Electrons trapped on the floating gate represent stored data. NAND flash stacks cells vertically (3D NAND) for massive storage.
AI Accelerator Chips & IoT Sensors
GPU: Thousands of small cores for parallel matrix multiplication โ ideal for neural network training.
TPU (Google's Tensor Processing Unit): Custom ASIC designed specifically for matrix operations in AI/ML.
IoT Sensors: Semiconductor-based sensors (temperature, pressure, gas, light) use changes in resistance, capacitance, or current due to physical stimuli.
MCQ Assessment โ Unit I
In the Drude model, the drift velocity of electrons is proportional to:
- Electric field strength
- Square of electric field
- Magnetic field
- Temperature
The Fermi-Dirac distribution function at $E = E_F$ gives a probability of:
- 0
- 1
- 0.5
- Depends on temperature
The band gap of Silicon at room temperature is approximately:
- 0.67 eV
- 1.12 eV
- 1.43 eV
- 5.5 eV
The Hall coefficient for an n-type semiconductor is:
- Positive
- Negative
- Zero
- Infinite
In a p-type semiconductor, the Fermi level is:
- At the middle of the band gap
- Close to the conduction band
- Close to the valence band
- Above the conduction band
Which material is used for LEDs because of its direct band gap?
- Silicon
- Germanium
- GaAs
- Diamond
Effective mass of an electron is determined from the E-k diagram by:
- Slope of the curve
- Curvature (second derivative)
- Area under the curve
- Y-intercept
Diffusion current in a semiconductor is caused by:
- Electric field
- Concentration gradient
- Magnetic field
- Temperature gradient only
In CMOS technology, zero static power consumption is achieved because:
- Both transistors are always ON
- Only one transistor (NMOS or PMOS) is ON at a time
- No transistors are used
- Capacitors store the charge
The fill factor of a solar cell is the ratio of:
- $V_{OC}$ to $I_{SC}$
- Maximum power to ($V_{OC} \times I_{SC}$)
- Input power to output power
- Band gap to photon energy
According to the Mass Action Law, in a semiconductor at thermal equilibrium:
- $n + p = n_i$
- $n \cdot p = n_i^2$
- $n - p = n_i$
- $n / p = n_i$
In an N-type semiconductor with donor concentration $N_D$, the minority carrier (hole) concentration is:
- $p = N_D$
- $p = n_i$
- $p = n_i^2 / N_D$
- $p = N_D / n_i$
In an N-type semiconductor, the donor impurity atom has how many valence electrons?
- 3
- 4
- 5
- 6
Which recombination process involves transfer of energy to a third carrier?
- Photon transition
- Shockley-Read-Hall (SRH)
- Auger recombination
- Impact ionization
The charge neutrality equation in a semiconductor is:
- $n = p$
- $n + N_A = p + N_D$
- $n \cdot p = N_D \cdot N_A$
- $n + N_D = p + N_A$
๐ Unit I Summary
- Drude Model: Free electrons, drift velocity $v_d = eE\tau/m$, conductivity $\sigma = ne^2\tau/m$
- Density of States: $n = \int g(E) \cdot f(E) \, dE$; counts available carriers at each energy
- Fermi-Dirac: $f(E) = 1/[1 + \exp((E-E_F)/kT)]$; $f(E_F) = 0.5$ always; $1-f(E)$ = hole probability
- Significance of Fermi Level: Separates filled/vacant states at 0 K; position indicates doping type
- Band Gap: Conductor (0 eV, overlapping), Semiconductor (0.1โ3 eV), Insulator (>3 eV, ~10 eV)
- Effective Mass: $m^* = \hbar^2/(d^2E/dk^2)$; holes = missing electrons with positive mass
- Hall Effect: $V_H = BI/(net)$; $R_H = 1/(ne)$; determines carrier type, concentration, mobility
- Intrinsic SC: $n = p = n_i$; $E_F \approx (E_C+E_V)/2$; $n_i = \sqrt{N_C N_V} \exp(-E_g/2kT)$
- Mass Action Law: $n \cdot p = n_i^2$ (always, regardless of doping)
- N-type: Pentavalent donor, $E_F$ near $E_C$, $n \approx N_D$; P-type: Trivalent acceptor, $E_F$ near $E_V$, $p \approx N_A$
- Charge Neutrality: $n + N_A^- = p + N_D^+$
- Generation/Recombination: Photon, SRH, Auger, Impact ionization; Carrier lifetime $\tau$, diffusion length $L = \sqrt{D\tau}$
- Direct bandgap (GaAs) โ LEDs/lasers; Indirect (Si) โ CPUs/ICs
- Ge vs Si: Ge ($E_g$ = 0.67 eV, $n_i$ = 2.4ร10ยนยณ/cmยณ); Si ($E_g$ = 1.12 eV, $n_i$ = 1.5ร10ยนโฐ/cmยณ)
Fundamentals of Electricity & Devices
โก India's Power Grid โ 1.4 Billion People, One Interconnected Circuit
India's power grid is the world's largest interconnected grid, connecting 1.4 billion people across 28 states. Reliance Jio laid 9 lakh km of optical fiber โ enough to wrap around Earth 22 times โ to bring 4G to every village. Every wire, every junction, every optical signal obeys the electrical laws you're about to master.
Fundamental Electrical Laws
Ohm's Law
The current $I$ through a conductor is directly proportional to the voltage $V$ across it:
$$V = IR$$Resistance depends on material and geometry: $R = \rho \frac{L}{A}$, where $\rho$ = resistivity, $L$ = length, $A$ = cross-sectional area.
Kirchhoff's Current Law (KCL)
The algebraic sum of all currents at any node is zero:
$$\sum I_{in} = \sum I_{out} \quad \text{or} \quad \sum I = 0$$Kirchhoff's Voltage Law (KVL)
The algebraic sum of all voltages around any closed loop is zero:
$$\sum V = 0$$Voltage & Current Division Rules
Voltage Division Rule (VDR) โ Derivation
For two resistors $R_1$ and $R_2$ in series connected to a source $V_s$:
Since series current is the same: $I = \frac{V_s}{R_1 + R_2}$
Voltage across $R_1$:
$$\boxed{V_1 = V_s \times \frac{R_1}{R_1 + R_2}}$$Voltage across $R_2$:
$$V_2 = V_s \times \frac{R_2}{R_1 + R_2}$$Solved Example โ VDR
Numerical
Problem: A 12V source is connected to $R_1 = 4\text{k}\Omega$ and $R_2 = 8\text{k}\Omega$ in series. Find voltage across each.
Solution: $V_1 = 12 \times \frac{4}{4+8} = 12 \times \frac{1}{3} = 4\text{V}$
$V_2 = 12 \times \frac{8}{12} = 8\text{V}$. Check: $4 + 8 = 12$ โ
Current Division Rule (CDR) โ Derivation
For two resistors $R_1$ and $R_2$ in parallel connected to a current source $I_s$:
Voltage across parallel combination: $V = I_s \times \frac{R_1 R_2}{R_1 + R_2}$
Current through $R_1$:
$$\boxed{I_1 = I_s \times \frac{R_2}{R_1 + R_2}}$$(Note: current through $R_1$ depends on the other resistor $R_2$.)
PN Junction Diode
Formation of PN Junction
When p-type and n-type semiconductors are joined:
- Electrons from n-side diffuse into p-side; holes from p-side diffuse into n-side.
- This creates a region depleted of free carriers: the depletion region.
- Immobile ions in the depletion region create a built-in potential $V_{bi}$ (โ0.7V for Si, 0.3V for Ge).
- The built-in field opposes further diffusion, establishing equilibrium.
Shockley Diode Equation
$$I = I_s\left(e^{qV/nkT} - 1\right)$$where $I_s$ โ 10โปยนยฒ A (reverse saturation current), $n$ = ideality factor (1โ2), $V_T = kT/q$ โ 26 mV at 300K.
V-I Characteristics
| Region | Condition | Current |
|---|---|---|
| Forward bias | $V > 0$ (p positive, n negative) | Exponentially increasing after $V_{bi}$ |
| Reverse bias | $V < 0$ | Small constant $-I_s$ (leakage) |
| Breakdown | $V < -V_{BR}$ | Sudden large reverse current |
Rectifier Applications
Half-Wave Rectifier: Uses one diode. Only positive half-cycle passes.
- $V_{dc} = \frac{V_m}{\pi} \approx 0.318 V_m$
- Ripple factor $\gamma = 1.21$ (very high)
- Efficiency $\eta = 40.6\%$
Full-Wave Rectifier (Bridge): Uses 4 diodes. Both half-cycles are rectified.
- $V_{dc} = \frac{2V_m}{\pi} \approx 0.636 V_m$
- Ripple factor $\gamma = 0.48$ (much better)
- Efficiency $\eta = 81.2\%$
| Parameter | Half-Wave | Full-Wave (Bridge) |
|---|---|---|
| No. of diodes | 1 | 4 |
| $V_{dc}$ | $V_m/\pi$ | $2V_m/\pi$ |
| Ripple factor | 1.21 | 0.48 |
| Efficiency | 40.6% | 81.2% |
| Transformer | Not needed | Not needed |
Bipolar Junction Transistor (BJT)
A BJT has three regions: Emitter (heavily doped), Base (thin, lightly doped), Collector (moderately doped, large area).
Current Relations
$$I_E = I_B + I_C$$ $$\alpha = \frac{I_C}{I_E} \quad (\text{common-base current gain, } \approx 0.95\text{โ}0.99)$$ $$\beta = \frac{I_C}{I_B} \quad (\text{common-emitter current gain, } \approx 50\text{โ}300)$$ $$\beta = \frac{\alpha}{1 - \alpha} \quad \text{and} \quad \alpha = \frac{\beta}{\beta + 1}$$Regions of Operation
| Region | BE Junction | BC Junction | Use |
|---|---|---|---|
| Active | Forward biased | Reverse biased | Amplification |
| Saturation | Forward biased | Forward biased | Switch ON |
| Cutoff | Reverse biased | Reverse biased | Switch OFF |
Solved Example โ BJT
Numerical
Problem: A BJT has $\beta = 100$ and $I_B = 20\mu$A. Find $I_C$ and $I_E$.
Solution: $I_C = \beta \cdot I_B = 100 \times 20\mu\text{A} = 2\text{ mA}$
$I_E = I_C + I_B = 2\text{ mA} + 0.02\text{ mA} = 2.02\text{ mA}$
$\alpha = \beta/(\beta+1) = 100/101 = 0.99$. Check: $\alpha \cdot I_E = 0.99 \times 2.02 = 2$ mA = $I_C$ โ
Optical Fiber Communication
Optical fibers transmit data as light pulses via Total Internal Reflection (TIR).
Critical angle (from Snell's law): When $\theta_r = 90ยฐ$:
$$n_1 \sin\theta_c = n_2 \sin 90ยฐ \implies \boxed{\theta_c = \sin^{-1}\left(\frac{n_2}{n_1}\right)}$$Numerical Aperture: $NA = \sqrt{n_1^2 - n_2^2}$ determines the light-gathering ability.
| Type | Single-Mode | Multi-Mode |
|---|---|---|
| Core diameter | 8โ10 ฮผm | 50โ62.5 ฮผm |
| Distance | Up to 100 km | Up to 2 km |
| Bandwidth | Very high | Moderate |
| Use | Long-haul telecom | LAN, data centers |
Wireless Communication โ Basics
Wireless signals use electromagnetic waves modulated to carry information:
- AM (Amplitude Modulation): Signal varies the amplitude of the carrier wave. Used in AM radio.
- FM (Frequency Modulation): Signal varies the frequency. Better noise immunity. Used in FM radio.
- Digital Modulation: ASK, FSK, PSK โ used in WiFi, 4G, 5G.
MCQ Assessment โ Unit II
In voltage division, the voltage across a resistor in series is proportional to:
- Its own resistance
- The other resistance
- Total current
- Total power
The built-in potential of a silicon PN junction is approximately:
- 0.3 V
- 0.7 V
- 1.1 V
- 5.0 V
The ripple factor of a full-wave bridge rectifier is:
- 1.21
- 0.48
- 0.00
- 2.00
If $\beta = 200$ for a BJT and $I_C = 4$ mA, the base current is:
- 20 ฮผA
- 200 ฮผA
- 0.8 A
- 2 mA
In an optical fiber, total internal reflection occurs when:
- Angle of incidence < critical angle
- Angle of incidence > critical angle
- Core has lower refractive index than cladding
- Light exits through the cladding
๐ Unit II Summary
- Ohm's Law: $V = IR$; KCL: $\sum I = 0$; KVL: $\sum V = 0$
- VDR: $V_1 = V_s \cdot R_1/(R_1+R_2)$; CDR: $I_1 = I_s \cdot R_2/(R_1+R_2)$
- Diode: $I = I_s(e^{V/nV_T}-1)$; $V_{bi}$ โ 0.7V (Si), 0.3V (Ge)
- HWR: $V_{dc} = V_m/\pi$, $\gamma = 1.21$; FWR: $V_{dc} = 2V_m/\pi$, $\gamma = 0.48$
- BJT: $I_E = I_B + I_C$, $\beta = I_C/I_B$, $\alpha = I_C/I_E = \beta/(\beta+1)$
- Optical Fiber: $\theta_c = \sin^{-1}(n_2/n_1)$; $NA = \sqrt{n_1^2 - n_2^2}$